DDR1 IMODs

LOGIC Devices' L9D1x series of integrated multi-chip module products are based on the semiconductor industry's first generation synchronous double-data-rate, dynamic random access memory architecture (SDRAM-DDR). This product group provides a highly integrated, space saving footprint which exhibits excellent performance benchmarks with internal power planes, impedance controlled micro-circuit laminate, as well as excellent thermal properties. This provides the designer a high performance, wide-word memory array with a maximum data transfer rate of 333 million bits per second (Mbps) for use in Industrial (-40°C to +85°C), Extended (-40°C to +105°C) and Mil-Temperature (-55°C to +125°C) environments. 

Applications: Main (core) memory, imaging system arrays, ultra-high density-multiport arrays, digital signal processor memory and data/video streaming servers. 

Features and Benefits:                 

Products:		1.0/1.2/2.0 & 2.5Gb, Wide-Word, DDR1 memory, x64 and x72/80 arrays

Footprint:

25mm2, Low Weight (</= 2.75grams)

Core Clocking:

100, 133 and 166MHz

Performance:

200, 266 and 333Mbps

Control Features:		DLL for data alignment
		DQS and Data Mask per byte, 8 or 10 bytes per IMOD
		Quad bank array architecture supporting concurrent operations
		Programmable IOL/IOH

Space Savings:

53% vs. Monolithic TSOPII-66 solution

Reduced I/O:

34% reduction in IO routing

Controlled Wire-length:		Short, equal distance trace length reducing parasitic capacitance
		Impedance matched (60Ω) packaging

Excellent Stability:		High TCE organic laminate interposer providing stability over a wide temperature range (micro-circuit card)