DDR3 IMODs
LOGIC Devices L9D3x family series of integrated multi-chip module products are based on the semiconductor industries, third generation synchronous double-data-rate, dynamic random access memory architecture (SDRAM-DDR3). This product group provides a highly integrated, space saving footprint which exhibits excellent performance benchmarks with internal power planes, impedance controlled micro-circuit laminate and packaged in a thermally enhanced PBGA, improving the already excellent thermal properties of standard PBGA. This provides the designer a high performance, wide-word memory array with a maximum data transfer rate of 1333 million bits per second (Mbps) for use in Industrial (-40°C to +85°C), 1066 Mbps for use in Extended applications (-40°C to +105°C) and 800 Mbps for use in Mil-Temperature (-55°C to +125°C) environments.
Applications: Main (core) memory, imaging system arrays, ultra-high density-multiport arrays, digital signal processor memory and data/video streaming servers or any other application/platform requiring memory array interfaces that push current performance boundaries.
Features and Benefits:
| Products: |
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2.0/4.0 & 4.5Gb, Wide-Word, Ultra Wide Word DDR3 memory, with array organizations of x32, x64 and x72 |
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| Footprint: |
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25mm2, 255 ball, Low Weight (</= 3.75grams) for x72 |
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16mm x 22mm, 271ball, Low Weight (</= 3.00grams) for x64 |
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| Space Savings: |
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25mm2 vs. the Monolithic solution: |
20% |
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16mm x 22mm vs. the Monolithic solution: |
40% |
| Reduced I/O: |
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25mm2 vs. the Monolithic solution: |
46% |
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16mm x 22mm vs. the Monolithic solution: |
30% |
| Core Clocking: |
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Industrial: 667/533/400MHz |
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Extended: 533/400MHz |
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Mil-Temp: 400MHz |
| Performance: |
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Industrial: 1333/1066/800Mbps |
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Extended: 1066/800Mbps |
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Mil-Temp: 800Mbps |
| Control Features: |
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DLL for data alignment |
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DQS and Data Mask per byte, 8 or 10 bytes per IMOD |
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Quad bank array architecture supporting concurrent operations |
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Programmable IOL/IOH |
| Controlled Wire-length: |
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Short, equal distance trace length reducing parasitic capacitance |
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Impedance matched (60Ω) packaging |
| Excellent Stability: |
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High TCE organic laminate interposer providing stability over a wide temperature range (micro-circuit card) |
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