Integrated Plastic Memory Modules (IMOD)

Logic Devices Integrated Module family (IMOD) provide high density, wide word memory arrays, sub-systems, and systems in a package.

The IMOD family is based on the integration on multiple silicon devices on an organic laminate substrate (micro circuit card) and encapsulated with standard, low viscosity, plastic encapsulated materials providing integrated product solutions with suitability of use in Industrial, Extended and Military temperature applications.

LOGIC's IMOD Technology:

		Multilayer, impedence controlled micro-circuit card with shortest, equal length etch placement
		Traditional die-attach, flip chip or IP die and package stacking

Features and Benefits:

		Significant board area savings
		Improved Electrical Characteristics:
		-Lower capacitance
		-Lower inductance
		-Controlled impedance
		-Excellent thermal properties
		-While minimizing manufacturing issues