Integrated Plastic Memory Modules (IMOD)

Logic Devices Integrated Module family (IMOD) will facilitate the integration of LOGIC Devices' IP as well as silicon IP from other semiconductor manufacturers, thereby providing high density, wide word memory arrays, sub-systems and systems in a package.

The IMOD family is based on the integration on multiple silicon on an organic laminate substrate (micro circuit card) and encapsulated with standard, low viscosity, plastic encapsulated materials providing integrated product solutions with suitability of use in Industrial, Extended and Military temperature applications.

LOGIC's IMOD Technology:

		Multilayer, impedence controlled micro-circuit card with shortest, equal length etch placement
		Traditional die-attach, flip chip or IP die and package stacking

Features and Benefits:

		Significant board area savings
		Improved Electrical Characteristics:
		-Lower capacitance
		-Lower inductance
		-Controlled impedance
		-Excellent thermal properties
		-While minimizing manufacturing issues